Clause AI-4: SRAM Thermal Integrity Bound

Clause AI-4: SRAM Thermal Integrity Bound

Fused Attention Kernels

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A physical-layer compliance constraint for GPU-accelerated AI inference. Addresses the reliability gap where JEDEC qualification protocols fail to account for hyper-localized thermal stress induced by Fused Attention Kernels. Establishes a formal thermal envelope for SRAM banks during fused kernel execution, bridging software optimization and hardware physics.

Files

File	Description
paper.pdf	Technical specification

Citation

DOI: 10.6084/m9.figshare.31286572

License

CC BY-NC-ND 4.0